Our Infra Red SMT rework station carefully monitors heat conditions during the repair process and can detect temperature differences of +/- 3 ° Celsius. Due to the no - nozzle design of this equipment we can make repairs that would be otherwise difficult to achieve with hot air systems.
BGA, CSP and Leadless Device Repair
We have the equipment to effectively rework BGA's CSP's and Leadless Devices. Using both hot air and infra red technologies we are able to easily rework devices that can not be repaired using conventional hand solder methods.
In house XRAY
ability helps us avoid delays, quickly flag possible defects and monitor
the assembly process for continuous improvement initiatives.