Semiconductor
Precision electronics for wafer fabrication equipment
Wafer fabrication equipment removes or deposits materials using plasma processes. It requires high currents, voltages and/or RF power — and the boards and subassemblies that control it demand precision manufacturing and rigorous testing. BSU partners with equipment makers from prototyping through production.
The WFE value chain — where we focus
BSU sits at the precision-component and NPI stage, supplying the subsystem integrators and tool OEMs who build wafer fabrication equipment.
Raw materials
Silicon, metals, quartz, process gases
Commodity inputsPrecision components
Machined parts · chambers · gas manifolds · PCBAs · cables
BSU — precision NPISubsystem integration
Gas delivery · RF power · vacuum control modules
Subsystem IPTool assembly (OEM)
Complete tool: chamber · robotics · controls · software
OEM system IPInstall & qualify
Fab install · process recipe development
Field servicesService & spares
Parts · consumables · software upgrades
Recurring revenueExample builds
Representative assemblies BSU has prototyped for semiconductor equipment makers.
| Assembly / PCBA | Primary functionality | End equipment |
|---|---|---|
| SoC / FPGA-based core control PCBA Active front-end and failsafe circuitry |
| Semiconductor laser-generator control system |
| High-frequency (40 MHz) half-rack timing board |
| Laser pulse-control subsystem for semiconductor etching equipment |
| Interface control board with embedded compute module |
| Generator interface and automation control platform |
| EMI filter board with soft-start functionality Designed for high-power (~30 kW) systems |
| High-power input-conditioning module for laser generators |
| High-power amplifier PCBA |
| Laser power delivery module |
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